Lapping and PolishingKemet DS18 Dual Face Grinding, Lapping and Polishing Machine
Part number
Kemet DS18
Production dual-face machines that grind, lap and polish both flat faces of parts at the same time, with five or six driven carriers. They hold very tight thickness and flatness tolerances on silicon, sapphire, optics and seal faces.
Dia. 390 mmMax part diameter
6Number of carriers
0.3 mmMin part thickness
0-60 rpmLower plate speed
Specifications
| Lapping plate | Dia. 1262 x ID 535 mm |
|---|---|
| Max part diameter | Dia. 390 mm |
| Carrier | 423.33 mm PCD |
| Number of carriers | 6 |
| Min part thickness | 0.3 mm |
| Lower plate speed | 0-60 rpm |
| Carrier reversal | CW and CCW |
| Machine size | 2530 x 1900 x 2260 mm (W x L x H) |
| Weight | 7000 kg |
| Electrical supply | 380V/415V 3Ph 50Hz |
| Options | Automatic thickness control |
Standards
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