Lapping and PolishingKemet DS-9 Dual Face Grinding, Lapping and Polishing Machine
Part number
Kemet DS-9

Production dual-face machines that grind, lap and polish both flat faces of parts at the same time, with five or six driven carriers. They hold very tight thickness and flatness tolerances on silicon, sapphire, optics and seal faces.
228.5 mm PCDCarrier
5Number of carriers
0.3 mmMin part thickness
0-60 rpmLower plate speed
Specifications
| Lapping plate | Dia. 630 x ID 245 mm |
|---|---|
| Max part diameter | Dia. 192.5 mm |
| Carrier | 228.5 mm PCD |
| Number of carriers | 5 |
| Min part thickness | 0.3 mm |
| Lower plate speed | 0-60 rpm |
| Carrier reversal | CW and CCW |
| Machine size | 1820 x 1232 x 2280 mm |
| Weight | 1800 kg |
| Electrical supply | 380/415V 3Ph 50/60Hz |
| Options | Automatic thickness control |
Standards
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